Reliability Design Method for Solder Joints Based on Coupled Thermal-Stress Analysis of Electronics Packaging Structure
نویسندگان
چکیده
منابع مشابه
Solder Joints in Electronics: Design for Reliability
The emerging new technologies provide ever more challenges to assure the reliability of electronic products. The ever increasing demands in electronic products for higher performance, lower cost, less space (weight) is leading to ever denser interconnection needs. This makes solder joint reliability an even more important issue with the advent of new surface mount packages and the use of surfac...
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Sn-Ag-Cu (SAC) alloy is currently recognized as the standard lead-free solder alloy for packaging of interconnects in the electronics industry, and highAg-content SAC alloys are the most popular choice. However, this choice has been encumbered by the fragility of the solder joints that has been observed in drop testing as well as the high cost of the Ag itself. Therefore, low-Ag-content SAC all...
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ژورنال
عنوان ژورنال: Journal of Japan Institute of Electronics Packaging
سال: 2006
ISSN: 1343-9677,1884-121X
DOI: 10.5104/jiep.9.405